Quantum chemical study on the dielectric constant of siloxane derivatives
Takahisa Adachi (

) and K.Yamashita
Chemical System Engineering, University of Tokyo, 7-3-1 Hongo,
Bunkyo Tokyo 113-8656, Japan.
The improvement of the operation speed by refinement of the integrated circuit
is indispensable in order to deal with the increase in the information
quantity with the progress of advanced information-oriented society. Signal
propagation delay time must be shortened for the speedup of the propagation
velocity, and that requires the lowering of dielectric constant of a layer
insulation film. The lowering of dielectric constant can make the insulation
layer thinner, and shorten the length of wiring.
In this study, we analyze theoretically dielectric constant of the siloxane
molecule and its derivatives based on ab initio quantum chemical HF and B3LYP
methods. Siloxane and its derivatives are expected as low-k layer insulation
membrane material at present. The derivatives considered are
halogen-substituted siloxanes in order to reduce molecular polarizability and
those with pentagonal or hexagonal rings in order to increase the vacancy
inside molecules. In order to analyze porosity of the system, we considered a
vacancy inside the system that is not counted in ordinary Monte Carlo volume
calculations. We discussed the dielectric constant of siloxane and its
derivatives not only based on the electric component of polarizability but
also on the ionic component that originates from molecular vibrations.