Kinetics of undoped silica deposition process in plasma-chemical SPCVD
technology
Alexander N. Denisov (

), A. S. Biriukov, and K. M. Golant
Fiber Optics Research Center at the
General Physics Institute of the Russian Academy of Sciences, 38 Vavilov St.,
119991 Moscow, Russia.
Kinetics of SiCl4 into SiO transformation process in oxygen plasma
ofstationary reduced-pressure microwave-induced discharge is studied
theoretically and experimentally. Calculations and experiments have been
carried out for an extended stationary plasma column, limited by substrate
tube silica walls (SPCVD technology). The model includes 10 components and
18 major chemical reactions, and gas mixture flow towards plasma column is
taken into proper account. The components distribution along the plasma
column was registered by emission spectroscopy. The reaction rate constants
of SiCln (n<=4) dissociation under the condition of discharge are estimated
by comparison of the calculated concentration profiles of the major plasma
components with the experimental data on the longitudinal profiles of their
emissions.