Investigation of Zirconia Film Growth on the (001) Silicon Surface Using the Integrated kMC-DR Approach

Andrey Knizhnik1 ( knizhnik-AT-kintech-DOT-ru.gif ), Alexander Bagatur'yants1, Boris Potapkin1 and Anatoli Korkin2
 1Kinetic Technologies, Kurchatov Sq. 1, 123182, Moscow, Russia.
 2Semiconductor Products Sector, Motorola Inc., 2200 W. Broadway Road, Mesa, AZ 85202, USA

The integrated kMC-DR method is applied to simulations of zirconia film growth in the ALD process. The kMC-DR method combines conventional kinetic Monte Carlo approach with geometry optimization steps (dynamic relaxation). We found that this method is suitable for the description of the formation of non-regular structures like amorphous films. The steady state film growth rate obtained from the simulations is in a reasonable agreement with experimental results for zirconia film growth rate in an ALD reactor, thus confirming the effect of steric hindrances on the film growth rate. We also found that the zirconium coordination number increases in course of film deposition. This feature of the film deposition process was not reproduced in previous models of the ZrO2-Si interface. The results obtained demonstrate formation of non-uniform ZrO2 film at the first ALD cycles because of the mismatch between the oxidized silicon support and the zirconia bulk structure. Residual terminal hydroxyl groups are also formed at the ZrO2-Si/SiO2 interface, and we note that such groups could significantly affect band lineup at the interface in accordance with similar results for the Si-SiO2 interface.